首页> 外国专利> The electrolytic polishing liquid, being electrolytic polishing manner of the copper, and the electrolytic polishing liquid

The electrolytic polishing liquid, being electrolytic polishing manner of the copper, and the electrolytic polishing liquid

机译:作为铜的电解抛光方式的电解抛光液和电解抛光液

摘要

PROBLEM TO BE SOLVED: To provide an electropolishing liquid for precisely and stablly electropolishing copper, a method for electropolishing copper with the use of the electropolishing liquid, and a method for manufacturing a semiconductor device.;SOLUTION: The electropolishing liquid for electropolishing copper includes a copper ion. The method for electropolishing copper is characterized by making the electropolishing liquid containing the copper ion exist between a material to be polished of an anode and a cathode, and electrolytically treating the material. The method for manufacturing the semiconductor device, which electropolishes metallic wires including copper, is characterized by making the electropolishing liquid containing the copper ion exist between the material to be polished of the anode and the cathode, and electrolytically treating the material.;COPYRIGHT: (C)2004,JPO
机译:解决的问题:提供一种用于精确且稳定地对铜进行电抛光的电抛光液,一种使用该电抛光液对铜进行电抛光的方法以及一种半导体器件的制造方法;解决方案:用于对铜进行电抛光的电抛光液包括:铜离子。电解抛光铜的方法的特征在于,使包含铜离子的电解抛光液存在于阳极和阴极的待抛光材料之间,并对该材料进行电解处理。用于电抛光包括铜的金属线的半导体器件的制造方法的特征在于,使包含铜离子的电抛光液存在于阳极和阴极的待抛光材料之间,并对该材料进行电解处理。 C)2004,日本特许厅

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号