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EPITAXIAL WAFER FOR SEMICONDUCTOR LUMINESCENT DEVICE AND SEMICONDUCTOR LUMINESCENT DEVICE
EPITAXIAL WAFER FOR SEMICONDUCTOR LUMINESCENT DEVICE AND SEMICONDUCTOR LUMINESCENT DEVICE
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机译:半导体发光器件和半导体发光器件的外延晶片
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摘要
PROBLEM TO BE SOLVED: To provide an epitaxial wafer capable of suppressing the diffusion of a p-type dopant to an active layer during crystalline growth or LED energization, and to provide a semiconductor luminescent device using the wafer.;SOLUTION: An Si dope n-type GaAs buffer layer 12, an Si dope n-type AlGaInP clad layer 13, an undope AlGaInP active layer 14, an Mg dope p-type AlGaInP clad layer 15, a first GaP current diffusion layer 17a (having a film thickness of 4 μm, a carrier concentration of 4.0×1018/cm3, and a carbon concentration of 1.0×1017cm-3), and a second GaP current diffusion layer 17b (having a film thickness of 8 μm, a carrier concentration of 4.0×1018/cm3, and a carbon concentration of 1.0×1018cm-3) are sequentially laminated on an Si dope n-type GaAs substrate 11.;COPYRIGHT: (C)2008,JPO&INPIT
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机译:解决的问题:提供一种外延晶片,该晶片能够在晶体生长或LED通电期间抑制p型掺杂剂扩散到有源层,并提供使用该晶片的半导体发光器件。型GaAs缓冲层12,Si掺杂n型AlGaInP覆盖层13,非掺杂AlGaInP活性层14,Mg掺杂p型AlGaInP覆盖层15,第一GaP电流扩散层17a(膜厚为4 μm,载流子浓度为4.0×10 18 Sup> / cm 3 Sup>,碳浓度为1.0×10 17 Sup> cm < Sup> -3 Sup>)和第二GaP电流扩散层17b(膜厚度为8μm,载流子浓度为4.0×10 18 Sup> / cm )然后,在Si掺杂n型GaAs衬底11上依次层叠3(Sup>)和1.0×10 10(Sup> 18 Sup> cm -3 Sup>)的碳浓度。 :(C)2008,JPO&INPIT
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