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HEATING DEVICE OF LIGHT IRRADIATION TYPE AND HEATING METHOD OF LIGHT IRRADIATION TYPE

机译:光照射类型的加热装置和光照射类型的加热方法

摘要

PROBLEM TO BE SOLVED: To improve the uniformity of illumination distribution on the surface of a workpiece without increasing the number of zones even for a spike annealing step.;SOLUTION: A plurality of lamps 1 are arranged in parallel, plane mirrors 2 are provided above the lamps 1, and guard rings 5 are arranged around a workpiece. The lamps 1 are comprised of I, II and III groups, and injection energy to the lamps 1 belonging to the III group is larger than those to the lamps 1 belonging to the I and II groups. A diffusion mirror 21 is located in the upper part corresponding to a workpiece 6 of the plane mirror 2, and light that is emitted from the lamp 1 belonging to the I and II groups and reflected on the reflection mirror 2 is given as diffused light to the work 6, thus improving the uniformity of illumination distribution on the surface of the wafer. In addition, there hardly exists light emitted from the lamps 1 belonging to the III group reflected on the diffusion mirror 21, thus keeping appropriate separation between the II group and the III group.;COPYRIGHT: (C)2008,JPO&INPIT
机译:解决的问题:为了提高工件表面照明分布的均匀性,甚至不进行尖峰退火步骤,也不增加区域数。解决方案:解决方案:多个灯1并排布置,上方设有平面镜2灯1和保护环5布置在工件周围。灯1由I,II和III组组成,并且对属于III组的灯1的注入能量大于对属于I和II组的灯1的注入能量。扩散镜21位于与平面镜2的工件6相对应的上部,并且从属于I和II族的灯1发射并在反射镜2上反射的光作为扩散光提供给工件6,从而提高了晶片表面上的照明分布的均匀性。另外,几乎不存在从属于第III组的灯1发出的光在漫射镜21上反射的情况,因此,使第II组和第III组之间保持适当的分离。版权所有:(C)2008,JPO&INPIT

著录项

  • 公开/公告号JP2008071787A

    专利类型

  • 公开/公告日2008-03-27

    原文格式PDF

  • 申请/专利权人 USHIO INC;

    申请/专利号JP20060246538

  • 申请日2006-09-12

  • 分类号H01L21/26;

  • 国家 JP

  • 入库时间 2022-08-21 20:23:37

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