首页> 外国专利> METHOD OF CONTROLLING MACHINING AMOUNT OF ELECTROLYTIC MACHINING, AND ELECTROLYTIC MACHINING APPARATUS

METHOD OF CONTROLLING MACHINING AMOUNT OF ELECTROLYTIC MACHINING, AND ELECTROLYTIC MACHINING APPARATUS

机译:电解加工的加工量控制方法及电解加工装置

摘要

PROBLEM TO BE SOLVED: To provide a method of controlling the machining amount in electrolytic machining by which a conductive film is uniformly removed while confirming the removing degree of the conductive film under electrolytic machining to eliminate insufficient machining or over machining of the conductive film in the removal of the conductive film on the surface of the wafer by electrolytic grinding, and an electrolytic machining apparatus.;SOLUTION: The electrolytic machining apparatus 1 includes a conductive film M color change detecting means 19 for detecting the change of the color in a machining boundary part S between the conductive film M removed area and the unremoved area of the wafer W with the progress of the electrolytic machining as an electric signal, a controller for calculating a machining boundary position and machining progress rate of the conductive film M on the basis of the color change detected in the conductive film color change detecting means 19, and a monitor for displaying the machining boundary position and the machining progression rate calculated in the controller. The conductive film M is removed by a machining head 3 moving from the center ○ toward the outer periphery of the wafer W. The electrolytic machining amount is controlled by monitoring the machining boundary position and the machining progression rate of the conductive film M during the removal machining.;COPYRIGHT: (C)2009,JPO&INPIT
机译:解决的问题:提供一种控制电解加工中的加工量的方法,通过该方法均匀地去除导电膜,同时确认电解加工下的导电膜的去除程度,以消除加工中导电膜的不充分加工或过度加工。解决方案:电解加工设备1包括导电膜M颜色变化检测装置19,用于检测加工边界内的颜色变化,该颜色变化检测装置19用于检测晶片表面上的导电膜。以电解加工的进展为电信号,在晶片W的导电膜M的去除区域和未去除区域之间的部分S中,基于该计算值来计算导电膜M的加工边界位置和加工进度的控制器在导电膜颜色变化检测装置19中检测到的颜色变化,以及用于显示控制器中计算出的加工边界位置和加工进度的监视器。导电膜M通过加工头3从中心c移动而去除。电解加工量是通过监测去除加工过程中导电膜M的加工边界位置和加工进度来控制的。COPYRIGHT:(C)2009,JPO&INPIT

著录项

  • 公开/公告号JP2008240038A

    专利类型

  • 公开/公告日2008-10-09

    原文格式PDF

  • 申请/专利权人 TOKYO SEIMITSU CO LTD;

    申请/专利号JP20070079962

  • 发明设计人 FUJITA TAKASHI;

    申请日2007-03-26

  • 分类号C25F7/00;C25F3/30;

  • 国家 JP

  • 入库时间 2022-08-21 20:23:15

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