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SUPPORT JIG USED IN FAILURE ANALYSIS OF SEMICONDUCTOR DEVICE AND FAILURE ANALYSIS METHOD USING SAME
SUPPORT JIG USED IN FAILURE ANALYSIS OF SEMICONDUCTOR DEVICE AND FAILURE ANALYSIS METHOD USING SAME
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机译:半导体器件故障分析中使用的支撑夹具和使用相同方法进行故障分析的方法
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摘要
PROBLEM TO BE SOLVED: To provide a support jig capable of obtaining a sufficient pattern resolution, resolution ability, and detection sensitivity for a miniaturized semiconductor device, in a backside analysis of the semiconductor device, and a failure analysis method.;SOLUTION: There is provided a support jig of a semiconductor device used in failure analysis for observing luminescence emitted through the observed part of the backside of the semiconductor device, in a state of applying a probe onto the surface of the semiconductor device. The support jig includes a contact coming in contact with a region excluding the observed part of the backside of the semiconductor device and a support, with one end side fixed to the contact and the other end side fixed to a part other than the semiconductor device. The contact is moved relatively to a wafer, so that the center of the contact approximately coincides with the center of the probe in analysis.;COPYRIGHT: (C)2008,JPO&INPIT
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