首页> 外国专利> PHOTOTOOL FOR SOLDER RESIST EXPOSURE AND SOLDER RESIST PATTERN FORMING METHOD IN WHICH EXPOSURE PROCESSING IS PERFORMED USING THE SAME

PHOTOTOOL FOR SOLDER RESIST EXPOSURE AND SOLDER RESIST PATTERN FORMING METHOD IN WHICH EXPOSURE PROCESSING IS PERFORMED USING THE SAME

机译:在使用相同的曝光处理的情况下进行防焊曝光的光敏抗蚀剂和形成防焊图案的方法

摘要

PROBLEM TO BE SOLVED: To provide a phototool for exposure processing of solder resist with which a high-resolution resist pattern can be formed with good reproducibility regardless of the thickness of a solder resist layer and the influence of a blue pigment, and to provide a solder resist pattern forming method in which exposure processing is performed using the phototool, and a photosensitive composition suitable for use in the forming method.;SOLUTION: The phototool is used in exposure processing in pattern formation of solder resist and has a photomask, wherein the phototool cuts off ≥50% of light of ≤370 nm and transmits ≥80% of light of ≥400 nm.;COPYRIGHT: (C)2008,JPO&INPIT
机译:解决的问题:提供一种用于阻焊剂的曝光处理的照相工具,利用该工具能够以良好的再现性形成高分辨率的抗蚀剂图案,而与阻焊剂层的厚度和蓝色颜料的影响无关。一种阻焊剂图案形成方法,其中使用该光刻工具进行曝光处理;以及一种适用于该形成方法的光敏组合物。 phototool切断了370 nm的50%的光,并透射了400 nm的80%的光。COPYRIGHT:(C)2008,JPO&INPIT

著录项

  • 公开/公告号JP2008122843A

    专利类型

  • 公开/公告日2008-05-29

    原文格式PDF

  • 申请/专利权人 TAIYO INK MFG LTD;

    申请/专利号JP20060309099

  • 发明设计人 SHIBAZAKI YOKO;ARIMA MASAO;KATO KENJI;

    申请日2006-11-15

  • 分类号G03F7/029;G03F7/031;G03F7/004;G03F7/20;G03F1/08;H05K3/00;H05K3/28;

  • 国家 JP

  • 入库时间 2022-08-21 20:22:38

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