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The 1st process which implements

机译:实施的第一道工序

摘要

PROBLEM TO BE SOLVED: To provide interboard connection technique of a laminated type wiring board where structure and manufacturing processes are simplified and narrow pitch of wiring is realized. ;SOLUTION: A plurality of board side electrodes 7 are arranged in face to face with each other in periperal parts of main surfaces of a plurality of wiring boards 1, 1' which are adjacent to each other in the widthwise direction. Trench parts 8 are arranged on side end surfaces of electrically insulating holding members 3 which fix the wiring boards 1, 1' in the edge direction at specified pitches, and conducting members 4 for interboard connection are buried in the trench parts 8. Consequently, a pair of the board side electrodes 7 which face with each other are electrically connected by using the conducting members 4 for interboard connection. That is, conducting members connecting the part between a pair of the wiring boards which face with each other interposing the insulating holding member 3 is formed by technique burying the conducting members 4 in the trench parts 8 arranged on the side end surface of the insulating holding member 3.;COPYRIGHT: (C)2000,JPO
机译:解决的问题:提供一种层压型配线板的板间连接技术,该结构简化了结构和制造工艺并且实现了窄的配线间距。解决方案:在宽度方向上彼此相邻的多个布线板1、1'的主表面的周缘部分中,面对面地布置有多个板侧电极7。在将绝缘基板1、1′在边缘方向上以规定的间距固定的电绝缘性的保持构件3的侧面,设置有沟槽部8,在该沟槽部8中埋入有用于板间连接的导电构件4。通过使用用于板间连接的导电构件4将彼此面对的一对板侧电极7电连接。即,通过将导电部件4埋入配置在绝缘保持部件的侧端面上的沟槽部8中,从而形成将在绝缘保持部件3之间相对的一对配线基板之间的部分连接的导电部件。成员3 .;版权:(C)2000,日本特许厅

著录项

  • 公开/公告号JP4151142B2

    专利类型

  • 公开/公告日2008-09-17

    原文格式PDF

  • 申请/专利权人 株式会社デンソー;

    申请/专利号JP19990015649

  • 发明设计人 川原 伸章;西川 英昭;

    申请日1999-01-25

  • 分类号H05K1/14;H01L25/00;H05K3/28;H05K3/36;H05K3/46;

  • 国家 JP

  • 入库时间 2022-08-21 20:21:13

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