Technique for reducing the scattering of electromagnetic waves near field using a high impedance coating material

摘要

In order to reduce the electromagnetic wave scattering effect in metal discontinuities, the present invention is to selectively use a high impedance layer (160). The high impedance layer can be fabricated using metallic materials commonly used electrostatic discharge (ESD) applications and (162), a resistive material (166). A thin film of metal is deposited on the surface of the dielectric substrate (164), the inner surface of the dielectric material, can be provided or the (162) metal layer, is embedded in the outer surface. The (162), current is induced RF is able to spread over the surface area of ​​the particular metal layer. You can attach a layer of (166) resistive material to (164) similar dielectric layer, as well as to reduce the RF surface wave, this resistive layer (166) is to minimize the scattering of electromagnetic waves printed circuit board in the (PCB) I do enough to decay. Furthermore, it can be attached as a very thin layer with (166) and the resistive material (162) metal material, it is possible to maintain sufficient transparency in the area desired, such as a display area of ​​the mobile phone.