Compositions and methods for drying the wafer is patterned during fabrication of the integrated circuit products

摘要

Drying of the wafer is patterned in a way to do without the degradation or breakdown of the pattern structure of the water removal from the wafer that is patterned is realized. In one aspect of the present invention, for forming a supercritical fluid, the reaction product shows a solubility in the supercritical fluid than water, and water reactive material of at least one chemically reacting with water drying is carried out by using the composition containing the. Various methods for the use of supercritical fluids for drying to avoid the supercritical fluid such as supercritical CO ₂ (solubility of water is low) defects, the wafer is patterned is described.