Wiring board base material and a method for manufacturing a multilayer wiring board base material

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing a base material for a multilayer wiring board which can form an IVH having highly conductive connecting reliability without uneven filling of conductive paste or uneven protruding shapes with conductive paste when a masking film is released, and which can obtain the multilayer wiring board having high positional accuracy and high density of a via hole.;SOLUTION: A copper foil 34 is used as the masking film provided on at least one surface of an insulating base material.;COPYRIGHT: (C)2004,JPO