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Growth method and device Si-Ge semiconductor material on a substrate

机译:在衬底上生长Si-Ge半导体材料的方法和器件

摘要

(Ge 50 atomic%) content of a Ge-rich and methods to be grown on Si (100) and Si-Ge materials with precise stoichiometric SiGe, the SiGe 4 and 2, SiGe 3 SiGe is provided. Using a new hydride with Si-Ge bonds directly obtained from the group (H 3 Ge) x SiH 4-x in (x = 1~4) compounds at low temperatures unprecedented about 300~450 ℃, and by growing the film planar (relayed) advanced relayed uniform low defect density, the buffer layer with a thickness and composition gradients necessary to use a lift-off method is completely eliminated. At about 500~700 ℃, narrow size distribution, SiGe x quantum dot is grown and elemental content of highly homogeneous at the atomic level and defect-free microstructure. The method, in which through integration into the membrane of the entire Si / Ge framework of the gaseous precursor and provide accurate control of the distortion form, composition, and structure. Material grown has a microstructural feature and morphological required for use in the buffer layer and the template for the development of commercial devices based on Ge channel and high mobility Si and optical systems, and high-frequency electronic have.
机译:(Ge> 50原子%)的富Ge含量以及在Si(100)和Si-Ge材料上使用精确化学计量的 SiGe, SiGe 4 生长的方法和2,提供了SiGe 3 SiGe。使用一种新的具有Si-Ge键的氢化物,该化合物直接从(x = 1〜4)化合物中的(H 3 Ge)x SiH 4-x 组中获得,其温度在空前的300〜450℃左右,并且通过生长膜平面的(中继的)先进的中继均匀的低缺陷密度,完全消除了具有剥离方法所必需的厚度和成分梯度的缓冲层。在大约500〜700℃的窄尺寸分布下,SiGe x 量子点生长,并且原子含量的元素含量高度均一且无缺陷的微观结构。该方法,其中通过将气态前体的整个Si / Ge骨架整合到膜中,并提供对形变形式,组成和结构的精确控制。所生长的材料具有用于缓冲层和用于开发基于Ge通道和高迁移率Si和光学系统以及高频电子的商业设备的模板所需的微观结构特征和形态。

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