首页> 外国专利> Pre-treatment solution for catalyst application of the electroless plating, the pre-processing method using a liquid, non-electrolytic plating film, and it was prepared using a method (or) plating covering body

Pre-treatment solution for catalyst application of the electroless plating, the pre-processing method using a liquid, non-electrolytic plating film, and it was prepared using a method (or) plating covering body

机译:用于化学镀的催化剂施加的预处理溶液,使用液态非电解镀膜的预处理方法,并使用(或)电镀覆盖体来制备

摘要

PROBLEM TO BE SOLVED: To provide pretreatment solution for providing catalyst for electroless plating, and a pretreatment method using the solution.;SOLUTION: The pretreatment solution comprises a silver colloidal solution containing, as essential components, at least the following components (I), (II) and (III): (I) silver colloidal particles, (II) one or two or more kinds of ions selected from ions of a metal having an electric potential capable of reducing silver ions to metal silver in the solution and/or ions oxidized at the time of reduction of the silver ions, and (III) one or two or more kinds of ions selected from hydroxycarboxylate ions, condensed phosphate ions and/or aminocarboxylate ions, the silver colloidal particles in (I) produced by the ions of the metal having an electric potential capable of reducing silver ions in (II) to metal silver. When an object to be plated is pretreated, effective catalyst for electroless plating is provided thereby.;COPYRIGHT: (C)2004,JPO&NCIPI
机译:解决的问题:提供用于提供用于化学镀的催化剂的预处理溶液,以及使用该溶液的预处理方法。解决方案:该预处理溶液包含银胶体溶液,该银胶体溶液至少包含以下组分(I)作为基本组分: (II)和(III):(I)银胶体粒子,(II)选自具有能够将溶液中的银离子还原为金属银的电位的金属的离子中的一种或两种以上的离子,和/或在还原银离子时被氧化的离子,以及(III)选自羟基羧酸根离子,缩合的磷酸根离子和/或氨基羧酸根离子中的一种或两种以上的离子,(I)中的银胶体颗粒由这些离子产生具有能够将(II)中的银离子还原为金属银的电势的金属。当对要镀的物体进行预处理时,可以提供有效的化学镀催化剂。版权所有:(C)2004,JPO&NCIPI

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