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A light-emitting diode chip sealing structure having a high-efficiency horizontal light-emitting effect.
A light-emitting diode chip sealing structure having a high-efficiency horizontal light-emitting effect.
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机译:具有高效率的水平发光效果的发光二极管芯片密封结构。
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摘要
An LED chip package structure with a high-efficiency light-emitting effect, includes a substrate unit, a light-emitting unit, and a package colloid unit. The substrate unit has a substrate body, and a positive electrode trace and a negative electrode trace respectively formed on the substrate body. The light-emitting unit has a plurality of LED chips disposed on the substrate body. Each LED chip has a positive electrode side and a negative electrode side respectively and electrically connected with the positive electrode trace and the negative electrode trace of the substrate unit. The package colloid unit has a plurality of package colloids covered on LED chips, respectively. Each package colloid has a colloid cambered surface formed on a top surface thereof and a colloid light-exiting surface formed on a front surface thereof.
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