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Laminate forming a phenolic resin, the production method of the phenolic resin laminates formed and phenolic resin laminate

机译:形成酚醛树脂的层压板,所形成的酚醛树脂层压板的制造方法和酚醛树脂层压板

摘要

PROBLEM TO BE SOLVED: To provide a phenolic resin for forming a laminate which can simultaneously improve the heat resistance, processability, flame retardance, and insulation properties of the phenolic resin laminate.;SOLUTION: By allowing the phenolic resin to have a weight average molecular weight of ≥1,000, the flexibility and toughness of the phenolic resin laminate to be manufactured from the phenolic resin are improved. Further, by rendering the weight average molecular weight of ≤5,000, and simultaneously rendering the total amount of molecules having a molecular weight of 300-500 not less than 15 wt.%, the distribution amount of low molecular weight components is secured, and when a substrate such as a paper substrate is impregnated with the phenolic resin composition, good impregnation properties are secured. Thereby, heat resistance, flame retardance and insulation properties are improved.;COPYRIGHT: (C)2004,JPO
机译:解决的问题:提供一种用于形成层压板的酚醛树脂,该酚醛树脂可同时提高酚醛树脂层压板的耐热性,可加工性,阻燃性和绝缘性能。;解决方案:通过使酚醛树脂具有重均分子量当重量小于或等于1,000时,由该酚醛树脂制造的酚醛树脂层压板的柔韧性和韧性得到改善。此外,通过使重均分子量为& 5,000,并且同时使分子量为300-500的分子的总量不小于15wt。%,确保了低分子量组分的分布量,并且当用酚醛树脂组合物浸渍纸基材等基材时,可以确保良好的浸渍性能。从而提高了耐热性,阻燃性和绝缘性。;版权所有:(C)2004,日本特许厅

著录项

  • 公开/公告号JP4036050B2

    专利类型

  • 公开/公告日2008-01-23

    原文格式PDF

  • 申请/专利权人 松下電工株式会社;

    申请/专利号JP20020218825

  • 发明设计人 辻本 雅哉;三輪 晃嗣;福原 康雄;

    申请日2002-07-26

  • 分类号C08G14/10;C08J5/24;B32B27/42;C08G8/00;C08G8/32;

  • 国家 JP

  • 入库时间 2022-08-21 20:18:12

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