Integrated power supply system analysis system, integrated power supply system analysis method, and multilayer printed circuit board

摘要

Information regarding the structure, physical constants, and mesh of the multilayer printed circuit board is input (step S701), and an equivalent circuit model of the multilayer printed circuit board is created (step S702). A transfer matrix is created with the uppermost LSI power supply terminal mounting candidate point as input and the lowermost LSI power supply terminal mounting candidate point as output (step S703), and the transfer matrix is converted into an impedance matrix (step S704). . Here, the first LSI mounting location is input (step S705), the optimal LSI mounting location is selected (step S706), and the optimal LSI mounting location and the remaining LSI mounting candidate locations are output in order (step S707).