首页>
外国专利>
Bonding pad structure, electronic device having a bonding pad structure and methods of fabricating the same
Bonding pad structure, electronic device having a bonding pad structure and methods of fabricating the same
展开▼
机译:键合焊盘结构,具有键合焊盘结构的电子设备及其制造方法
展开▼
页面导航
摘要
著录项
相似文献
摘要
An electronic device having a bonding pad structure and a method of fabricating the same is provided. The electronic device may include a first bonding pads formed on the substrate. A second bonding pad may be formed on the lower insulating layer. The second bonding pads may be spaced apart from the first bonding pads. The second bonding pads may have a top surface formed at a higher level than the first bonding pads.
展开▼