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Apparatus for detecting press-bonded ball at bonding portion in bonding apparatus and method for detecting press-bonded ball at bonding portion

机译:用于检测键合装置中的键合部处的压焊球的设备和用于检测键合部中的压焊球的方法

摘要

A detecting apparatus used in a bonding apparatus including a capillary and a detection camera disposed with a certain amount of offset from the capillary and capable of detecting a press-bonded ball at a bonding portion after bonding. For a pad in which two edges of a press-bonded ball corresponding to two adjacent sides of the pad are definite, the detecting apparatus detects the respective distances between the two sides of the pad and the corresponding two edges of the press-bonded ball, and compares the detected values to determine if these values fall within previously set allowable ranges; and if the detected values are outside the allowable ranges, the amount of offset is corrected so that the press-bonded ball comes within the allowable ranges.
机译:结合装置中使用的检测装置,其包括毛细管和检测照相机,所述检测相机相对于所述毛细管偏移一定量,并且能够在结合后检测结合部处的压焊球。对于其中压焊球的与两个相邻边相对应的两个边缘确定的垫,检测装置检测垫的两侧与压焊球的对应两个边之间的各自距离,并比较检测到的值以确定这些值是否在先前设置的允许范围内;如果检测值在容许范围之外,则对偏移量进行校正,以使压焊球落入容许范围内。

著录项

  • 公开/公告号US2008259352A1

    专利类型

  • 公开/公告日2008-10-23

    原文格式PDF

  • 申请/专利权人 KENJI SUGAWARA;YONG CHEN;

    申请/专利号US20080074758

  • 发明设计人 YONG CHEN;KENJI SUGAWARA;

    申请日2008-03-06

  • 分类号G01B11/24;G01B11/14;

  • 国家 US

  • 入库时间 2022-08-21 20:15:49

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