首页> 外国专利> Organic semiconductor materials using stacking-inducing compounds, compositions comprising such materials, organic semiconductor thin films formed using such compositions, and organic electronic devices incorporating such thin films

Organic semiconductor materials using stacking-inducing compounds, compositions comprising such materials, organic semiconductor thin films formed using such compositions, and organic electronic devices incorporating such thin films

机译:使用引起堆积的化合物的有机半导体材料,包含该材料的组合物,使用该组合物形成的有机半导体薄膜,以及包含该薄膜的有机电子器件

摘要

Disclosed are organic semiconductor materials, including mixtures of relatively low molecular weight aromatic ring compounds, in which at least one nitrogen atom or oxygen atom is present as a heteroatom in the aromatic ring compounds for forming hydrogen bonds between the heteroatom(s) and adjacent molecules and thereby increase intermolecular stacking. Organic semiconductor layers formed using such organic semiconductor materials will, accordingly, exhibit increased intermolecular stacking and associated improvements in one or more electrical properties of the semiconductor layer. Organic thin film transistors incorporating such organic semiconductor layers will tend to exhibit improved transistor properties including, for example, increased carrier mobility and reduced off-state leakage current. Further, the organic semiconductor layers may be manufactured using conventional room temperature processes, for example, spin coating or printing, thereby simplifying the fabrication process.
机译:公开了有机半导体材料,包括相对低分子量的芳族环化合物的混合物,其中至少一个氮原子或氧原子作为杂原子存在于芳族环化合物中以在杂原子和相邻分子之间形成氢键从而增加了分子间的堆积。因此,使用这样的有机半导体材料形成的有机半导体层将表现出分子间堆叠的增加以及半导体层的一种或多种电性质的相关改善。结合了这种有机半导体层的有机薄膜晶体管将倾向于表现出改善的晶体管特性,包括例如增加的载流子迁移率和减小的截止态漏电流。此外,可以使用常规的室温工艺例如旋涂或印刷来制造有机半导体层,从而简化了制造工艺。

著录项

  • 公开/公告号US2007287220A1

    专利类型

  • 公开/公告日2007-12-13

    原文格式PDF

  • 申请/专利权人 EUN JEONG JEONG;BANG LIN LEE;

    申请/专利号US20070700028

  • 发明设计人 EUN JEONG JEONG;BANG LIN LEE;

    申请日2007-01-31

  • 分类号H01B1/12;H01L27/01;

  • 国家 US

  • 入库时间 2022-08-21 20:15:28

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