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Stabilization and Performance of Autocatalytic Electroless Processes

机译:自催化化学过程的稳定性和性能

摘要

Disclosed is a method of plating a substrate with a metal using an autocatalytic electroless plating bath wherein the bath is operated above its cloud point temperature such that at least two phases are present in the bath. An autocatalytic electroless plating bath for coating silver metal is also described. A method for autocatalytic plating of silver metal directly onto a silicon surface without the need for an intervening layer of metal is also disclosed. The deposits of silver obtained are uniform, non-porous and have electrical properties. The technique can be applied for different processes and bath formulations i.e. different metals, complexing agents and reducing agents.
机译:公开了一种使用自动催化化学镀浴以金属镀覆基板的方法,其中,所述浴在高于其浊点温度的条件下操作,使得所述浴中存在至少两相。还描述了用于涂覆银金属的自催化化学镀浴。还公开了一种将银金属直接自动催化镀在硅表面上而无需金属中间层的方法。获得的银沉积物是均匀的,无孔的并且具有电性能。该技术可用于不同的工艺和浴配方,即不同的金属,络合剂和还原剂。

著录项

  • 公开/公告号US2008206474A1

    专利类型

  • 公开/公告日2008-08-28

    原文格式PDF

  • 申请/专利权人 ANDERS REMGARD;

    申请/专利号US20050791512

  • 发明设计人 ANDERS REMGARD;

    申请日2005-12-13

  • 分类号B05D1/18;B32B15/04;C04B41/51;

  • 国家 US

  • 入库时间 2022-08-21 20:15:08

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