首页> 外国专利> COPPER ALUMINUM LAMINATE FOR REPLACING SOLID COPPER SHEETING

COPPER ALUMINUM LAMINATE FOR REPLACING SOLID COPPER SHEETING

机译:铜铝层压板,用于代替固体铜皮

摘要

The invention is a laminate made of very thin copper sheet preferably between 0.0005 and 0.01 inches thick, aluminum sheet preferably between 0.004 and 0.04 inches thick, and adhesive between the copper and aluminum sheets. The cost of the aluminum, adhesive, and the manufacturing process combined are much less expensive than solid copper sheet of 0.020 inches in thickness. However, when the copper sheet of the laminate is on the outside, the aesthetic qualities are indistinguishable from heavyweight solid copper sheet.
机译:本发明是由非常薄的铜片,优选地在0.0005至0.01英寸厚之间,铝板,优选地在0.004至0.04英寸之间,以及铜和铝板之间的粘合剂制成的层压板。与厚度为0.020英寸的固态铜片相比,铝,粘合剂和制造工艺的成本要便宜得多。然而,当层压体的铜片在外侧时,美学质量与重量级固体铜片没有区别。

著录项

  • 公开/公告号US2008182121A1

    专利类型

  • 公开/公告日2008-07-31

    原文格式PDF

  • 申请/专利权人 MICHAEL A. MICHAUD;

    申请/专利号US20080021990

  • 发明设计人 MICHAEL A. MICHAUD;

    申请日2008-01-29

  • 分类号B32B15/20;C09J5/00;

  • 国家 US

  • 入库时间 2022-08-21 20:13:41

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