Film-forming system, film-forming method, insulating film, dielectric film, piezoelectric film, ferroelectric film, piezoelectric element and liquid discharge system

摘要

A film forming system includes a vacuum chamber introduction and discharge of film-forming gas into and from which are capable. A target holder is disposed in the vacuum chamber to hold a target, a substrate holder is opposed to the target holder and holds a film-forming substrate on which film is formed and a plasma forming portion generates plasma between the target holder and the film-forming substrate. The film-forming system is characterized by having a shield which surrounds the outer peripheral surface of the target holder facing the substrate.