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Complementarily doped metal-semiconductor interfaces to reduce dark current in MSM photodetectors

机译:互补掺杂的金属半导体界面可减少MSM光电探测器中的暗电流

摘要

Metal-Semiconductor-Metal (“MSM”) photodetectors and methods to fabricate thereof are described. The MSM photodetector includes a thin heavily doped (“delta doped”) regions deposited at an interface between metal contacts and a semiconductor layer to reduce a dark current of the MSM photodetector. Band engineering at the metal-semiconductor interfaces using complementarily delta doped semiconductor regions to fix two different interface workfunctions. Delta doping the grounded contact interface with p+ and the reverse biased interface with n+ enhances the Schottky barrier faced by both electrons and holes at the point of injection from source contact into the channel and at the point of collection from the channel into the drain contact.
机译:描述了金属半导体金属(“ MSM”)光电探测器及其制造方法。 MSM光电检测器包括沉积在金属触点与半导体层之间的界面处的薄重掺杂(“δ掺杂”)区域,以减小MSM光电检测器的暗电流。在金属-半导体界面处进行带工程设计,使用互补增量掺杂的半导体区域来固定两个不同的界面功函数。 δ用p +掺杂接地的接触界面,而用n +掺杂反向偏置的界面,在从源极接触注入到沟道的注入点以及从沟道到漏极接触的收集点,电子和空穴都面临肖特基势垒。

著录项

  • 公开/公告号US2008001181A1

    专利类型

  • 公开/公告日2008-01-03

    原文格式PDF

  • 申请/专利权人 TITASH RAKSHIT;MIRIAM RESHOTKO;

    申请/专利号US20060477722

  • 发明设计人 MIRIAM RESHOTKO;TITASH RAKSHIT;

    申请日2006-06-28

  • 分类号H01L27/148;

  • 国家 US

  • 入库时间 2022-08-21 20:12:44

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