首页> 外国专利> TEST MARK STRUCTURE, SUBSTRATE SHEET LAMINATE, MULTILAYERED CIRCUIT SUBSTRATE, METHOD FOR INSPECTING LAMINATION MATCHING PRECISION OF MULTILAYERED CIRCUIT SUBSTRATE, AND METHOD FOR DESIGNING SUBSTRATE SHEET LAMINATE

TEST MARK STRUCTURE, SUBSTRATE SHEET LAMINATE, MULTILAYERED CIRCUIT SUBSTRATE, METHOD FOR INSPECTING LAMINATION MATCHING PRECISION OF MULTILAYERED CIRCUIT SUBSTRATE, AND METHOD FOR DESIGNING SUBSTRATE SHEET LAMINATE

机译:测试标记结构,基材板叠层,多层电路基材,多层电路基材的叠层匹配精度的检查方法以及基材叠层的设计方法

摘要

An inspection mark structure has an inspection via hole, which is provided in substrate sheets to be heat-pressed constituting at least two layers of laminates; a round pattern electrode, which is formed on one main face side of the substrate sheet provided with the inspection via hole, and provided around the end face of the inspection via hole at such a predetermined distance as not to come into contact with the end face; and a conduction electrode, which is formed on the other main face side of the substrate sheet provided with the inspection via hole, and provided so as to be electrically connected with the end face of the inspection via hole.
机译:检验标记结构具有检验通路孔,该检验通路孔设置在构成至少两层层压板的要被热压的基板中。圆形图案电极,该圆形图案电极形成在具有检查通孔的基板片的一个主表面侧上,并且以不与端面接触的预定距离围绕检查通孔的端面设置。 ;导电电极形成在具有检查用通孔的基板片的另一主面上,并与检查用通孔的端面电连接。

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号