THREE-DIMENSIONAL ARCHITECTURE FOR SELF-CHECKING AND SELF-REPAIRING INTEGRATED CIRCUITS

摘要

A three-dimensional architecture chip includes a base chip including a unit integrated thereon and configured to perform electrical signal operations. An active layer is separately fabricated from the base layer. The active layer includes a component to service the unit of the base chip. The active layer is bonded to the base chip such that the component is aligned in vertical proximity of the unit. An electrical connection connects the unit to the component through vertical layers of at least one of the base chip and the active layer.