首页> 外国专利> Beam neutralization in low-energy high-current ribbon-beam implanters

Beam neutralization in low-energy high-current ribbon-beam implanters

机译:低能量大电流带束注入机中的束中和

摘要

The fabrication of modern semiconducting integrated circuits often requires implantation steps that involve high currents of low-energy charged dopant atoms. When employing such beams, the addition of electrons or negative ions for neutralizing the effects of space charge is often crucial for achieving success. Without this supplement, ion beams can ‘blow-up’ causing loss of intensity and disruption of beam focusing. In the present disclosure, methods are presented for introducing and constraining neutralizing low-energy electrons and negative ions within the boundaries of ribbon beams within regions of magnetic field deflection. Apparatus is described for maintaining neutralization based upon a reduction of electron losses, plasma bridge connections and secondary electron production. As part of plasma introduction to the deflection region a novel cryogenic pumping apparatus selectively removes neutral atoms from a plasma stream.
机译:现代半导体集成电路的制造通常需要注入步骤,该注入步骤涉及高电流的低能量带电掺杂剂原子。当采用此类束时,添加电子或负离子以抵消空间电荷的影响通常对于取得成功至关重要。如果没有这种补充,离子束会“爆炸”,导致强度损失和束聚焦中断。在本公开中,提出了用于在磁场偏转区域内的带状束的边界内引入和约束中和低能电子和负离子的方法。描述了一种用于基于电子损失的减少,等离子体桥连接和二次电子产生来维持中和的设备。作为将等离子体引入偏转区域的一部分,新型的低温泵浦设备选择性地从等离子体流中除去中性原子。

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