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Method for Reducing Transition Metal, and Method for Treating Surface of Silicon-Containing Polymer, Method for Preparing Fine Transition Metal Particles and Method for Producing Article and Wiring Board, Using the Reducing Method
Method for Reducing Transition Metal, and Method for Treating Surface of Silicon-Containing Polymer, Method for Preparing Fine Transition Metal Particles and Method for Producing Article and Wiring Board, Using the Reducing Method
A surface treating method for metallizing the surface of a polymer containing silicon by the use of a non-expensive material and a method for metallizing the surface of or forming a pattern of a metal layer such as a wiring on the surface of a substrate comprising an arbitrary material, or a method for producing fine particles of a specific transition metal are provided. The method for treating the surface of a silicon-containing polymer or a method for preparing fine transition metal particles involves contacting an organosilicon compound with a solid, a solution or a suspension of a specific transition metal salt, to reduce and precipitate the transition metal and thereby precipitate fine particles of the transition metal on the surface of said organosilicon compound or in the organosilicon compound.
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