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High aspect ratio micromechanical probe tips and methods of fabrication

机译:高深宽比的微机械探针和制造方法

摘要

A method of fabricating high aspect ratio micromechanical tips is provided. The method includes, but is not limited to, forming an etchant protective island on a surface of a silicon substrate with the silicon substrate exposed around the island; isotropically etching the silicon substrate by reactive ion etching around the protective island to partially undercut the silicon substrate beneath the protective island; anisotropically etching, by deep reactive ion etching, the silicon surrounding the island to a desired depth to define a tip shaft of the desired height supported at a base by the substrate; removing the protective island from the tip; and sharpening the top of the tip shaft to an apex. Using the method, micromechanical tips having heights greater than at least 30 μm have been obtained while maintaining the vertical sidewall necessary for both AFM and scanning near-field microwave microscopy (SNMM) profiling applications.
机译:提供了一种制造高纵横比的微机械尖端的方法。该方法包括但不限于在硅衬底的表面上形成蚀刻剂保护岛,并使硅衬底暴露在岛周围。通过反应性离子蚀刻在保护岛周围各向同性地蚀刻硅衬底,以在保护岛下方对硅衬底进行部分底切;通过深反应性离子蚀刻,各向异性地蚀刻围绕岛的硅至期望的深度,以限定出具有期望高度的尖端轴,该尖端轴被基板支撑在基底处;从尖端移除保护岛;并将尖端轴的顶部削尖至顶点。使用该方法,在保持AFM和扫描近场微波显微镜(SNMM)轮廓分析应用所需的垂直侧壁的同时,获得了高度大于至少30μm的微机械尖端。

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