首页> 外国专利> Measurement of bias of a silicon area using bridging vertices on polysilicon shapes to create an electrical open/short contact structure

Measurement of bias of a silicon area using bridging vertices on polysilicon shapes to create an electrical open/short contact structure

机译:使用桥接形状的多晶硅形状来测量硅区域的偏置,以创建电断开/短路接触结构

摘要

An apparatus and method are disclosed for measuring bias of polysilicon shapes relative to a silicon area wherein the presence of an electrical coupling is used to determine the presence of bias. Bridging vertices on the polysilicon shapes are formed. Bridging vertices over the silicon area create low resistance connections between those bridging vertices and the silicon area; other bridging vertices over ROX (recessed oxide) areas do not create low resistance connections between those other bridging vertices and the silicon area. Determining which bridging vertices have low resistance connections to the silicon area and how many bridging vertices have low resistance connections to the silicon area are used to determine the bias of the polysilicon shapes relative to the silicon area.
机译:公开了一种用于测量相对于硅区域的多晶硅形状的偏置的装置和方法,其中电耦合的存在用于确定偏置的存在。形成了多晶硅形状上的桥接顶点。硅区域上的桥接顶点会在这些桥接顶点和硅区域之间形成低电阻连接; ROX(凹陷氧化物)区域上的其他桥接顶点不会在这些其他桥接顶点与硅区域之间建立低电阻连接。确定哪些桥接顶点与硅区域的电阻连接低以及有多少桥接顶点与硅区域的电阻连接低,用于确定多晶硅形状相对于硅区域的偏置。

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