Method for manufacturing device for supporting substrate during semiconductor manufacture, involves forming surface roughness on upper surface of plate by electromagnetic radiation without disturbing initial flat surface of plate

摘要

A device comprising a flat plate with upper surface is formed in which the upper surface has an initial flat surface. The surface roughness is formed on the upper surface of plate at which the substrate is to be positioned without disturbing the initial flat surface of the upper surface. An independent claim is also included for device for supporting substrate during semiconductor manufacture.