首页> 外国专利> CHROMIUM-FREE ETCHING SOLUTION FOR SI-SUBSTRATES AND SIGE-SUBSTRATES, METHOD FOR REVEALING DEFECTS USING THE ETCHING SOLUTION AND PROCESS FOR TREATING SI-SUBSTRATES AND SIGE-SUBSTRATES USING THE ETCHING SOLUTION

CHROMIUM-FREE ETCHING SOLUTION FOR SI-SUBSTRATES AND SIGE-SUBSTRATES, METHOD FOR REVEALING DEFECTS USING THE ETCHING SOLUTION AND PROCESS FOR TREATING SI-SUBSTRATES AND SIGE-SUBSTRATES USING THE ETCHING SOLUTION

机译:用于SI基质和SIGE基质的无铬蚀刻溶液,使用蚀刻溶液消除缺陷的方法以及使用该蚀刻溶液处理SI基质和SIGE基质的过程

摘要

Abstract Chromium-free Etching Solution for Si-substrates and SiGe-substrates, Method for Revealing Defects using the Etching Solution and Process for Treating Si-substrates and SiGe-substrates using the Etching SolutionThe present invention relates to a novel etching solution suitable for characterizing defects on semiconductor surfaces, including silicon germanium surfaces, as well as a method for treating semiconductor surfaces with an etching solution as disclosed herein. This novel etching solution is chromium-free and enables a highly sufficient etch rate and highly satisfactory etch results.Figure 3
机译:抽象用于硅衬底和硅锗衬底的无铬蚀刻溶液,方法蚀刻溶液和处理工艺来清除缺陷的方法使用蚀刻解决方案的Si衬底和SiGe衬底本发明涉及一种适于表征缺陷的新型蚀刻溶液。在半导体表面(包括硅锗表面)上的方法以及用本文公开的蚀刻溶液处理半导体表面。这本小说蚀刻溶液不含铬,可实现足够高的蚀刻速率和高度令人满意的蚀刻结果。图3

著录项

  • 公开/公告号SG143125A1

    专利类型

  • 公开/公告日2008-06-27

    原文格式PDF

  • 申请/专利权人 S.O.I.TEC SILICON ON INSULATOR TECHNOLOGIES;

    申请/专利号SG20070168206

  • 发明设计人 ALEXANDRA ABBADIE;

    申请日2007-10-11

  • 分类号H01L21/306;H01L21/02;

  • 国家 SG

  • 入库时间 2022-08-21 20:05:39

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