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PHOTOLUMINESCENCE IMAGING WITH PREFERENTIAL DETECTION OF PHOTOLUMINESCENCE SIGNALS EMITTED FROM A SPECIFIED MATERIAL LAYER OF A WAFER OR OTHER WORKPIECE
PHOTOLUMINESCENCE IMAGING WITH PREFERENTIAL DETECTION OF PHOTOLUMINESCENCE SIGNALS EMITTED FROM A SPECIFIED MATERIAL LAYER OF A WAFER OR OTHER WORKPIECE
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机译:具有优先检测从晶片或其他工件的特定材料层发出的光致发光信号的光致发光成像
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摘要
A method and apparatus uses photoluminescence to identify defects in one or more specified material layers of a sample. One or more filtering elements are used to filter out predetermined wavelengths of return light emitted from a sample. The predetermined wavelengths are selected such that only return light emitted from one or more specified material layers of the sample is detected. Additionally or alternatively, the wavelength of incident light directed into the sample may be selected to penetrate the sample to a given depth, or to excite only one or more selected material layers in the sample. Accordingly, defect data characteristic of primarily only the one or more specified material layers is generated.
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