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HIGHLY ADAPTABLE HETEROGENEOUS POWER AMPLIFIER IC MICRO-SYSTEMS USING FLIP CHIP AND MICROELECTROMECHANICAL TECHNOLOGIES ON LOW LOSS SUBSTRATES
HIGHLY ADAPTABLE HETEROGENEOUS POWER AMPLIFIER IC MICRO-SYSTEMS USING FLIP CHIP AND MICROELECTROMECHANICAL TECHNOLOGIES ON LOW LOSS SUBSTRATES
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机译:在低损耗基底上使用倒装芯片和微机电技术的高度自适应的异构功率放大器IC微系统
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摘要
A first MEM (329) having first and second contact is mounted on a substrate. A PA power cell is thermally connected to the substrate using a thermal bump. The power cell has first and second power cell bumps as pathways for I/O functions. A first insulator (319) is mounted on substrate supporting a second MEM (327), having first and second connections, located on a bottom surface. This first conductive via (313) traverses the first insulator and connect the first connection from the second MEM to a first conductor connected to the first power cell bump . The second conductor (335) is connected to a second conductive via (307), which traverses a second insulator. The second conductive via is connected to a first metal member. The second conductive via is connected to a first metal member (305) formed over the upper surface of the second insulator and connected to a first input to the first MEM switch. A second metal member (303) is connected to the second contact of the first MEM switch.
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