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Monolithically integrated circuit comprising a thin film resistor, and fabrication method thereof

机译:包括薄膜电阻器的单片集成电路及其制造方法

摘要

A monolithically integrated circuit comprises a thin film resistor (8) with low resistance and low temperature coefficient; a high frequency lateral power transistor device (9) including gate (17), source (16) and drain (15) regions, and a Faraday shield layer region (22; 22') above the gate region; and at least a first metallization layer (28) there above for electrical connection of the gate (17), source (16) and drain (15) regions through via holes filled with conductive material (29c-d). The thin film resistor (8) and the Faraday shield layer region (22; 22') are made in the same conductive layer, which is arranged below the first metallization layer (28).
机译:一种单片集成电路,包括具有低电阻和低温度系数的薄膜电阻器(8);高频横向功率晶体管器件(9),包括栅极(17),源极(16)和漏极(15)区域,以及在栅极区域上方的法拉第屏蔽层区域(22; 22');至少一个第一金属化层(28),用于通过填充有导电材料(29c-d)的通孔电连接栅极(17),源极(16)和漏极(15)区域。薄膜电阻器(8)和法拉第屏蔽层区域(22; 22')在同一导电层中制成,该导电层布置在第一金属化层(28)下方。

著录项

  • 公开/公告号EP1526575A3

    专利类型

  • 公开/公告日2008-05-07

    原文格式PDF

  • 申请/专利权人 INFINEON TECHNOLOGIES AG;

    申请/专利号EP20040445089

  • 发明设计人 NORSTRÖM HANS;JOHANSSON TED;

    申请日2004-09-07

  • 分类号H01L27/06;H01L29/417;H01L29/40;H01L29/78;H01L21/336;

  • 国家 EP

  • 入库时间 2022-08-21 19:58:56

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