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LOW TEMPERATURE CURING OF TOUGHENED EPOXY ADHESIVES
LOW TEMPERATURE CURING OF TOUGHENED EPOXY ADHESIVES
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机译:增韧环氧树脂胶的低温固化
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摘要
Surfaces are bonded together using a thermoplastic toughened epoxy adhesive wherein the adhesive contains an epoxy component, a thermoplastic component, a core/shell particle component and a curing agent. The thermoplastic toughened epoxy adhesive is only heated during bonding to a relatively low curing temperature of between 140°C and 160°C for a sufficient time to cure the adhesive and provide surfaces that are bonded together with a high-strength bond.
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