LOW TEMPERATURE CURING OF TOUGHENED EPOXY ADHESIVES

摘要

Surfaces are bonded together using a thermoplastic toughened epoxy adhesive wherein the adhesive contains an epoxy component, a thermoplastic component, a core/shell particle component and a curing agent. The thermoplastic toughened epoxy adhesive is only heated during bonding to a relatively low curing temperature of between 140° C. and 160° C. for a sufficient time to cure the adhesive and provide surfaces that are bonded together with a high-strength bond.