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TWO-LAYER FLEXIBLE SUBSTRATE, METHOD FOR MANUFACTURING THE TWO-LAYER FLEXIBLE SUBSTRATE, AND FLEXIBLE PRINTED WIRING BOARD MANUFACTURED FROM THE TWO-LAYER FLEXIBLE SUBSTRATE
TWO-LAYER FLEXIBLE SUBSTRATE, METHOD FOR MANUFACTURING THE TWO-LAYER FLEXIBLE SUBSTRATE, AND FLEXIBLE PRINTED WIRING BOARD MANUFACTURED FROM THE TWO-LAYER FLEXIBLE SUBSTRATE
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机译:两层柔性基板,制造两层柔性基板的方法以及由两层柔性基板制造的柔性印刷线路板
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摘要
[PROBLEMS] To provide a two-layer flexible substrate which, even when allowed to stand at an elevated temperature of about 150°C, even at an elevated temperature of about 180°C, for a long period of time causes no significant lowering in adhesive strength between an insulating film and a copper layer (hereinafter often referred to as “peel strength”), particularly a two-layer flexible substrate suitable for fine pattern formation/COF mounting, and a method for manufacturing the two-layer flexible substrate. [MEANS FOR SOLVING PROBLEMS] A two-layer flexible substrate comprising an insulating film, a substrate metallic layer provided by a dry-type plating method directly on at least one side of the insulating film without interposing any adhesive agent, and a copper conductor layer having a desired layer thickness on the substrate metallic layer, characterized in that the substrate metallic layer is crystalline and is composed mainly of nickel-chromium or nickel-chromium-molybdenum in which 0.5 to 4.8 atomic% of a nitrogen atom has been dissolved.
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