首页> 外国专利> Wave soldering device with exchangeable soldering baths, the latter being moveable in a perpendicular direction relative to the conveyor providing the workpieces ; Process of wave soldering of workpieces with exchange of soldering baths

Wave soldering device with exchangeable soldering baths, the latter being moveable in a perpendicular direction relative to the conveyor providing the workpieces ; Process of wave soldering of workpieces with exchange of soldering baths

机译:带有可更换焊池的波峰焊装置,后者可相对于提供工件的输送机沿垂直方向移动;更换波峰焊的波峰焊工艺

摘要

A device for wave soldering components, has first- and second-solder reservoirs (6,7) with a solder wave and a device for feeding the components along a feed path (2). The first- and second-solder reservoirs are movably arranged transversely to the feed path. An independent claim is included for a method for wave soldering of components.
机译:一种用于波峰焊接元件的装置,具有带有焊料波的第一和第二焊料储存器(6,7),以及用于沿着进料路径(2)进料元件的装置。第一和第二焊料储存器横向于进料路径可移动地布置。对于组件的波峰焊接方法包括独立权利要求。

著录项

  • 公开/公告号EP1736269B1

    专利类型

  • 公开/公告日2008-07-30

    原文格式PDF

  • 申请/专利权人 LINDE AKTIENGESELLSCHAFT;EPM HANDELS AG;

    申请/专利号EP20050022154

  • 发明设计人 ISLER HANS;WANDKE ERNST DR.;

    申请日2005-10-11

  • 分类号B23K1/08;B23K3/06;B23K3/08;B23K1;

  • 国家 EP

  • 入库时间 2022-08-21 19:57:56

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