Method for fixing miniaturised components onto a base plate by soldering with high precision

摘要

A high-precision method of fixing a micro-miniaturized component on to a support plate (4), which is generally made of a metallic material especially an alloy of a metallised ceramic material and encloses the fixture section (3) by at least one fixture web (9) of a recessed region bridging over the carrier plate (4), involves high-precision arrangement of the component above the fixture section (3) such that the solder material (8) and the base (7) of the component are located without contact and spaced in counter-overlay.