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LASER FEMTOSECOND MICROTOME FOR CUTTING OUT A MATERIAL SLICE BY A LASER BEAM, IN PARTICULAR IN A CORNEA
LASER FEMTOSECOND MICROTOME FOR CUTTING OUT A MATERIAL SLICE BY A LASER BEAM, IN PARTICULAR IN A CORNEA
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机译:激光飞秒秒显微术,用于通过激光束切出特定的切片,特别是在角膜中
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摘要
A laser femtosecond microtome for cutting out by a focused laser beam at least one slice of material in a material block, wherein the block includes a front surface and the slice carrying the front surface, the slice extends at least partially substantially in a X, Z plane perpendicular to an axis Y of the block thickness, the slice is separated from the remaining part of the block by a cleavage surface formed by an assembly of bubbles brought together, each bubble is formed in a focus area of at least one convergent laser beam pulse of an optical axis L. According to the invention, the optical axis L of the convergent part (3) of the laser beam forms an angle ranging between -45° and ±45° relative to the X, Z. The ellipsoid-shaped focus area has its smaller axis in the direction of the axis Y.
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