APPRATUSS FOR CLEANING A SURFACE OF WAFERS, NOZZLE ARM AND METHOD FOR CLEANING A SURFACE OF WAFERS

摘要

A wafer surface cleaning apparatus and a method for cleaning a nozzle arm and a surface of a wafer are provided to enhance productivity by simplifying a manufacturing process and lowering an error rate. A wafer surface cleaning apparatus includes a chamber wall(110), a rotary shaft(120), a chuck(130) positioned on an upper part of the rotary shaft to load a wafer on an upper surface thereof, an injection hole(160) formed in the inside of the chuck to inject gas or liquid onto a bottom surface of the wafer, and a nozzle arm(180) for injecting the gas, water, and chemicals onto the surface of the wafer loaded on the upper surface of the chuck. The nozzle arm includes a plurality of unit nozzles. The chuck includes a wafer supporting ring and a plurality of wafer fixing pins.