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EQUIPMENT FOR MANUFACTURING SEMICONDUCTOR DEVICE AND ALIGNER OF WAFER MAPPING SENSOR

机译:制造半导体器件的设备和晶片映射传感器的警报器

摘要

Equipment for manufacturing a semiconductor device and an aligner of a wafer mapping sensor in the equipment are provided to fix an exact position of the wafer mapping sensor and to reduce a repairing time by employing a first feed gauge and a second feed gauge for aiming an incident light. A plate(162) is formed between a light emitting unit and a light receiving unit to be in a horizontal state. A first feed gauge(164) is formed on an upper portion of a side of the plate and is to aim light from the light emitting unit to a predetermined direction. A second feed gauge(166) is formed on the other side of the upper portion of the plate to be opposite to the first feed gauge. The second feed gauge is to aim the light being aimed from the first feed gauge and being received to the light receiving unit. The second feed gauge includes a support(167) and a second hole(168). The support has a predetermined height from the plate. The light passes through the second hole.
机译:提供一种用于制造半导体器件的设备以及该设备中的晶片映射传感器的对准器,以通过采用用于对准入射的第一进给量规和第二进给量规来固定晶片映射传感器的精确位置并减少维修时间。光。板(162)形成在发光单元和光接收单元之间以处于水平状态。第一进给量规(164)形成在板的一侧的上部上,并且用于将来自发光单元的光聚焦到预定方向。第二进给量规(166)形成在板的上部的另一侧,与第一进给量规相对。第二进给量规用于对准从第一进给量规对准并被接收到光接收单元的光。第二进给量规包括支撑件(167)和第二孔(168)。支撑件距板具有预定高度。光线穿过第二个孔。

著录项

  • 公开/公告号KR20070115365A

    专利类型

  • 公开/公告日2007-12-06

    原文格式PDF

  • 申请/专利权人 SAMSUNG ELECTRONICS CO. LTD.;

    申请/专利号KR20060049659

  • 发明设计人 SHIN SEUNG HUN;

    申请日2006-06-02

  • 分类号H01L21/68;

  • 国家 KR

  • 入库时间 2022-08-21 19:54:45

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