DEVICE BONDING PRINTED CIRCUIT BOARD, METHOD FOR CONTROLLING IT AND SYSTEM BONDING PRINTED CIRCUIT BOARD

摘要

A circuit board bonding apparatus, a method for controlling the same, and a circuit board bonding system are provided to reduce a processing time by loading or unloading a flat display panel at another working stage during a process at one working stage. A circuit board bonding apparatus includes a working unit, a plurality of working stages(110a,110b), a plurality of loading and unloading units(120a,120b), and a control unit. The working unit performs a work for bonding a circuit board for a driving on a flat display panel. The plurality of working stages support the flat display panel, and transmit the flat display panel to the working unit. The plurality of loading and unloading units are set to correspond to the plurality of working stages, load the flat display panel on the working stages, or unload the flat display panel from the working stages. The control unit controls an alternative movement of the plurality of working stages to the working unit so that other working stage performs a corresponding work at the loading and unloading units when one of the working stages is put on the working unit to perform a bonding work of the circuit board for the driving.