首页> 外国专利> SYSTEM FOR MANAGE UNITY PARTS OF SEMICONDUCTOR MANUFACTURING EQUIPMENT AND APPLICATION METHOD OF HINDRANCE PARTS

SYSTEM FOR MANAGE UNITY PARTS OF SEMICONDUCTOR MANUFACTURING EQUIPMENT AND APPLICATION METHOD OF HINDRANCE PARTS

机译:半导体制造设备整体零件管理系统及零件的使用方法

摘要

A system for managing unity parts of semiconductor manufacturing equipment and an application method of hindrance parts are provided to prevent consumption of an unnecessary time by performing an application process rapidly. A PDA(52) includes a bar code reader for reading bar codes attached to parts in order to apply corresponding hindrance parts. A mobile application server(54) is connected to the PDA through the internet(56) in order to receive data related to part information from the PDA and to transmit the received data to an equipment management server(58). The mobile application server transmits the information received from the equipment management server to the PDA. The equipment management server is connected to the internet in order to manage unity parts and receive application information related to the hindrance parts. The equipment management server manages the unity parts and stores the application information related to the hindrance parts.
机译:提供一种用于管理半导体制造设备的整体部件的系统和障碍部件的施加方法,以通过快速执行施加过程来防止不必要的时间的消耗。 PDA(52)包括条形码读取器,该条形码读取器用于读取附接到部件的条形码以便施加相应的障碍部件。移动应用服务器(54)通过互联网(56)连接到PDA,以便从PDA接收与零件信息有关的数据,并将接收到的数据发送到设备管理服务器(58)。移动应用服务器将从设备管理服务器接收的信息发送到PDA。设备管理服务器连接到Internet,以便管理统一部件并接收与障碍部件有关的应用程序信息。设备管理服务器管理统一部件并存储与障碍部件有关的应用程序信息。

著录项

  • 公开/公告号KR20080059716A

    专利类型

  • 公开/公告日2008-07-01

    原文格式PDF

  • 申请/专利权人 SAMSUNG ELECTRONICS CO. LTD.;

    申请/专利号KR20060133362

  • 发明设计人 YOUN JU HWAN;CHUN YONG SUK;

    申请日2006-12-26

  • 分类号H01L21/02;

  • 国家 KR

  • 入库时间 2022-08-21 19:53:27

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