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SYSTEM FOR MANAGE UNITY PARTS OF SEMICONDUCTOR MANUFACTURING EQUIPMENT AND APPLICATION METHOD OF HINDRANCE PARTS
SYSTEM FOR MANAGE UNITY PARTS OF SEMICONDUCTOR MANUFACTURING EQUIPMENT AND APPLICATION METHOD OF HINDRANCE PARTS
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机译:半导体制造设备整体零件管理系统及零件的使用方法
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摘要
A system for managing unity parts of semiconductor manufacturing equipment and an application method of hindrance parts are provided to prevent consumption of an unnecessary time by performing an application process rapidly. A PDA(52) includes a bar code reader for reading bar codes attached to parts in order to apply corresponding hindrance parts. A mobile application server(54) is connected to the PDA through the internet(56) in order to receive data related to part information from the PDA and to transmit the received data to an equipment management server(58). The mobile application server transmits the information received from the equipment management server to the PDA. The equipment management server is connected to the internet in order to manage unity parts and receive application information related to the hindrance parts. The equipment management server manages the unity parts and stores the application information related to the hindrance parts.
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