COIL EMBEDDED BOARD, COIL EMBEDDED CIRCUIT BOARD AND POWER MODULE USING THE SAME, MOULD FOR FABRICATING COIL EMBEDDED BOARD AND FABRICATION METHOD OF COIL EMBEDDED CIRCUIT BOARD USING THE SAME

摘要

A coil embedded board, a coil embedded circuit board and a power module using the same, a mold for fabricating the coil embedded board and a fabricating method of the coil embedded circuit board using the same are provided to implement modularization of circuit components by directly forming a circuit wiring pattern on a surface of the coil embedded board and mounting an active or passive circuit element. A coil embedded board(10) includes a coil(11), a magnetic board(12), and a terminal(14). The coil is embedded in the magnetic board. The magnetic board has magnetic powder, a silica film, and a binder. The silica film is an insulating film coated on a surface of the magnetic powder and formed by oxidation of perhydropolysilazane. The binder binds the magnetic powder coated with the silica film. The terminal is formed on one surface of the magnetic board and electrically connected to the coil.