Anisotropic conductive film with highly reliable bonding and circuit connecting structure using anisotropic conductive film

摘要

The anisotropic conductive film according to the present invention , by an insulating adhesive as a base material , which is an anisotropic conductive particles are dispersed as the conductive film , when heating the anisotropic conductive film, in 200 characterized in that the mass decrement of the anisotropic conductive film is 0 to 5%. ; on the other hand, a circuit connecting structure according to the invention , in the circuit connection structure having a heat-pressing the member to be connected by using the anisotropic conductive film , bubbles are generated in the anisotropic conductive film is characterized in that 0-10% of the total area . ; this the anisotropic conductive film according to the invention , less bubbling connection reliability is improved .