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A Method for Increasing Dissolution Rate of Tin Granule

机译:一种提高锡粒溶解速度的方法

摘要

insoluble anode electro-plated tin-plated in the plating process used to make up for the missing tin ions When dissolving metallic tin particles is reduced by introducing the second phase dissolves in the reaction system of the tin to a method for increasing the rate of dissolution of metallic tin particles. Palladium on titanium particles with a particle tin, platinum and at least one noble metal is coated with a noble metal-coated particles with particle diameter of 1~10 selected from the group consisting of the gold to the surface area ratio of the total surface area of the tin particles 10 to The dissolution rate of the particles is increased by the addition of tin to be 50%. ; Thus, it is possible to dissolve the tin using a small amount of oxygen as compared to the prior art, the amount of oxygen blown into the tin oxide is reduced sludge production is reduced to less than 1/3. Divalent tin by the oxygen blown into the tin 2 in the same amount of oxygen as the oxidation of the ions is reduced the amount of dissolved ions also increase.
机译:不溶性阳极电镀锡,用于弥补缺失的锡离子,在电镀过程中进行电镀时,通过将第二相溶解在锡的反应体系中以增加溶解速率的方法来减少金属锡颗粒的溶解金属锡颗粒。具有锡,铂和至少一种贵金属的钛颗粒上的钯涂有粒径为1〜10的,选自金与总表面积之比的涂覆有贵金属的颗粒通过添加锡使锡颗粒10的溶解度增加到50%。 ;因此,与现有技术相比,可以使用少量的氧气来溶解锡,吹入氧化锡中的氧气的量减少,污泥产生减少至小于1/3。通过吹入锡2中的氧而使二价锡的氧含量与离子的氧化量相同,溶解离子的量也增加。

著录项

  • 公开/公告号KR100805024B1

    专利类型

  • 公开/公告日2008-02-20

    原文格式PDF

  • 申请/专利权人

    申请/专利号KR20010082564

  • 发明设计人 김태엽;

    申请日2001-12-21

  • 分类号C25D3/32;

  • 国家 KR

  • 入库时间 2022-08-21 19:52:30

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