MIRROR CHAMFERED WAFER, MIRROR CHAMFERING POLISHING CLOTH, AND MIRROR CHAMFERING POLISHING MACHINE AND METHOD

摘要

The present invention provides a mirror-chamfering wafers with reduced non-uniform wafer periphery, the wafer processing abrasive cloth, a polishing apparatus and the polishing method. The wafer is provided by regulating the width-over policy of the single flat mirror or less 400㎛. Further, the in the polishing cloth, the Asker C The single-layer structure with at least two-layer multi-layer structure bonded to the foam layer, or only the polishing cloth layer of a hardness of 65 or more polishing cloth layer and the Asker C hardness of 40 or less. Further, the polishing apparatus, a polishing method, the polishing on a rotary drum attached to the cloth, and while supplying the abrasive liquid provides to fulfill the mirror chamfering the wafer rotating at a rotational device in contact Sikkim and the contact portion at a predetermined angle .