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METHOD FOR FORMING FINE COPPER PARTICLE SINTERED PRODUCT TYPE OF ELECTRIC CONDUCTOR HAVING FINE SHAPE, METHOD FOR FORMING FINE COPPER WIRING AND THIN COPPER FILM USING SAID METHOD
METHOD FOR FORMING FINE COPPER PARTICLE SINTERED PRODUCT TYPE OF ELECTRIC CONDUCTOR HAVING FINE SHAPE, METHOD FOR FORMING FINE COPPER WIRING AND THIN COPPER FILM USING SAID METHOD
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机译:具有细形状的导体的细铜颗粒烧结产品类型的形成方法,利用所述方法形成细铜布线和薄铜膜的方法
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摘要
The present invention, by using a dispersion of copper fine particles having a surface oxide film layer, after fine pattern writing, under a relatively low temperature, subjected to reduction treatment in the fine copper particles or copper oxide particles having a surface oxide film layer in the pattern, the copper fine particles to generate the firing, and offers a method of forming a fine-shaped conductor of a copper fine particle sintered product which exhibits excellent conductivity, a dispersion containing the copper fine particles or the copper oxide fine particles having a surface oxide film layer or less of the average particle diameter on the substrate 10㎛ coated, and then by heating the fine particles in the coating layer, the compounds of the vapor having reducing ability, to an atmosphere of a temperature below 350 ℃, including gas, oxide, by a reduction reaction using a compound having its reducibility as a reducing agent subjected to reduction of the coating film, and subsequently, by heating a combination of the original process and the oxidation treatment in a short time jaehwan repeating the process, a step of forming a sintered product layer of copper fine particles obtained cross, carried out in a series of heat treatment processes. ; Conductor, or a forming method
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