METHOD FOR FORMING METAL WIRING ON FLEXIBLE SUBSTRATE BY ELECTROLESS PLATING

摘要

A method for forming a fine metal wiring on a flexible substrate by selective electroless plating is provided to form the metal wiring, using a plasma surface process or the electroless plating so as to improve bonding ability between an organic substrate and the metal wiring and to form the metal wiring selectively. A method for forming a fine metal wiring(5) on a flexible organic substrate(1) by selective electroless plating comprises the steps of; providing the flexible organic substrate; forming a photosensitive insulator(3) on the substrate; patterning the photosensitive insulator, using an optical mask having a pattern(13); processing a plasma surface on one surface of the substrate(14); transferring an adsorption preventing film of a catalyst on the photosensitive insulator selectively; and forming the metal wiring, using an electroless plating or electroplating process. An inorganic thin film(12) is formed on the substrate.