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METHOD FOR FORMING METAL LINE PATTERN BY USING SELECTIVE ELECTROLESS PLATING ON FLEXIBLE SUBSTRATE
METHOD FOR FORMING METAL LINE PATTERN BY USING SELECTIVE ELECTROLESS PLATING ON FLEXIBLE SUBSTRATE
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机译:在柔性基板上使用选择性化学镀形成金属线型的方法
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摘要
PURPOSE: A method for forming a metal line pattern by using selective electroless plating on a flexible substrate is provided to plate metal through an electroless plating by making selectively catalyst absorbed to a self-assembled monolayer through an inkjet printing. CONSTITUTION: A method for forming a metal line pattern by using selective electroless plating on a flexible substrate is comprised of the steps: forming a pattern of the self-assembled monolayer on a substrate base by an inkjet printing; making a catalyst particle absorbed to the self-assembled monolayer which is patterned in forming the self-assembled monolayer; and forming a metal pattern on the absorbed catalyst particle through an electroless plating.
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